In the global semiconductor value chain, Malaysia has always been a global center for testing and assembling – and no one knows that better than Intel Corp. The US chip giant has been in the Southeast Asian nation for the last 51 years, with Malaysia opening Intel’s first international manufacturing facility in 1972.
In December 2021, the company renewed its commitment, which includes a US$7 billion investment over the course of a decade, bringing the total investment in Malaysia by the US chip giant to US$14 billion as of 2032. The US$7 billion in investments is mainly to increase the size of its operations in Penang and Kulim, Kedah.
As it is, Malaysia is Intel’s largest offshore site, with a workforce exceeding 10,000 employees across two campuses in Penang and Kulim. It is one of the largest assembly and test facilities, and a mature site with multi-functions in manufacturing, design, development, and local and global support services.
It has just been revealed that another factory being built in Penang will be Intel’s first overseas facility for advanced 3D chip packaging, known as Intel’s Foveros technology. Malaysia will eventually become Intel’s largest production base for 3D chip packaging, Robin Martin, corporate vice president for manufacturing supply chain and operations, told reporters this week.
The company is also building a chip assembly and testing factory in Kulim for its US$7 billion expansion in Malaysia. For context, Malaysia is currently the world’s sixth-largest exporter of semiconductors, and Intel contributes an average of 20% of its total semiconductor exports annually.
According to techwireasia.com. Source of photo: internet
